Professor Bongtae Han Delivers Invited Talk at Korean Semiconductor EventProfessor Bongtae Han of CALCE was invited as an international expert speaker to the 2025 Incheon Global Semiconductor Workshop held on November 25, 2025, at the Oakwood Premier Incheon Hotel in Songdo, Incheon, Korea. At this high-profile event, organized by Inha University and supported by Incheon Metropolitan City, Professor Han delivered an invited talk titled “New Perspective on Advanced Thermoset-based Manufacturing Process: Can We Design the Process?”, highlighting CALCE’s leadership in advanced semiconductor packaging and reliability research.
The workshop brought together approximately 100 participants from semiconductor companies, universities, research institutes, and industry associations to strengthen a global network among industry, academia, and research institutes, and foster next-generation semiconductor talent. CALCE UMD's participation, through Professor Han's contribution on thermoset-based manufacturing and design-for-reliability concepts, underscored the center's pivotal role in shaping advanced packaging technologies and supporting international collaboration in Korea's rapidly evolving semiconductor ecosystem. Professor Bongtae Han is Keystone Professor of Mechanical Engineering at the University of Maryland, where he directs the Laboratory for Optomechanics and Micro/Nano Semiconductor/Photonics Systems and is affiliated with the Center for Advanced Life Cycle Engineering. He received his Ph.D. in Engineering Science and Mechanics from Virginia Tech in 1991 after earning B.S. and M.S. degrees in Energy Resources Engineering from Seoul National University in 1981 and 1983, respectively. His research centers on the mechanics and reliability of electronic and photonic packaging, including warpage prediction, stress analysis, and design for reliability in semiconductor and photonics systems. Professor Han is a Fellow of both the Society for Experimental Mechanics and the American Society of Mechanical Engineers, and his honors include the IBM Excellence Award, SEM’s Brewer Award, multiple best paper awards, and the ASME Mechanics Award in the Electronics and Photonics Packaging Division. He has held key editorial roles and currently serves as Editor-in-Chief of the journal Microelectronics Reliability, reflecting his leadership in semiconductor packaging reliability For more information about CALCE research on advanced semiconductor packaging and optomechanics-based metrology, contact Prof. Bongtae Han.
December 10, 2025 Prev Next |
