CALCE Presentation on Counterfeit Screening IEEE Conference

CALCE Presentation on Counterfeit Screening IEEE Conference

CALCE Presentation on Counterfeit Screening IEEE Conference

The IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) 2025 was held October 14 to 16, in Denver, Colorado, bringing together researchers and professionals devoted to hardware security, inspection, and supply chain assurance in electronics. The conference featured presentations and discussions on advanced metrologies, packaging, physical fingerprinting, side-channel analysis, countermeasures, and artificial intelligence applied to inspection and assurance.

Pecht book cover

Devon Richman, a Ph.D. candidate working with Prof. Michael Pecht and Dr. Michael Azarian, presented “Power Spectrum Analysis-Based Counterfeit Screening: A Hardware Comparison”. His work evaluated side-channel power spectrum analysis (PSA) methods for detecting counterfeit microelectronic components, comparing the Chiplytics PSA system and conventional benchtop equipment, with data analyzed via principal component analysis and k-means clustering. The conference was attended by industry, academic, and government bodies who came together to discuss the current and future challenges with microelectronic physical assurance and the inspection of electronic devices. Key topics included the critical role of digital twins, the need and development of next-generation defect detection methods with the move to backside power delivery and superconducting electronics, and how artificial intelligence can be used to improve inspection processes and the challenges it presents to the workforce. Papers were presented alongside posters that covered topics ranging from side-channel attacks, counterfeit and tamper detection, and new inspection techniques.

This research is part of the Air Force Small Business Technology Transfer (STTR) project titled "Part Assessment Based on Side Channel Testing," a collaboration between CALCE and Chiplytics. The project pioneers the use of side-channel testing as a fast, non-destructive approach to assess microelectronic quality and reliability by capturing unique multi-pin frequency responses. It aims to enhance classification accuracy and facilitate cost-effective adoption of this technology for mission-critical defense and commercial applications, strengthening supply chain assurance.

For more information, contact Dr. Michael Azarian and Dr. Diganta Das.

October 22, 2025


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